Lenovo announced a new low-temperature welding process (LTS – Low Temperature Solder – patent pending) developed to improve the production of PCsaving energy and increasing the affidabilità.Fin by the abandonment of the use of soldering the lead-based, more than 10 years ago, for environmental reasons, the electronics industry has been looking for a solution to reduce the heat, the energy consumption and carbon emissions, to improve the welding process based on tin that has replaced the first process based piombo.Il welding process based on tin used in fact normally requiresextremely high temperatures, which consume more energy and put under stress components. With the new LTS, Lenovo process introduces a radical change in the production, applicable to Lenovo products but not only: it is a method that can be universally applied to the entire electronics manufacturing involving printed circuit boards with no extra costs or negative impact on performance of the product for users finali.La real innovation consists inscientific progress and the tests necessary to develop and validate the new LTS process. Lenovo has tried thousands of combinations of materials of the solder paste composed of a mixture of tin, copper, bismuth, nickel and silver, specific compositions of fluxing material and the temperature and heat that combine to enable this process. As is typical in standard processes of electronics assembly, using surface mount technology (SMT), the mixtureof solder and flux it is first printed on the surface of the circuit board. Added components, heat is applied to melt the welding mixture, and fix and connect the components to the board. With the new LTS process the welding heat is applied at a maximum temperature of 180 ° Celsius, with a reduction of 70 degrees compared to the previous method. In the course of testing and verification, Lenovo has used existing materials to composethe solder paste and the current bakery equipment for heating, so as to implement the new system without increasing the production costs. After validation of the new procedure, Lenovo has discovered a significant reduction in carbon emissions result from the use of the new process. The procedure is already in production for the series ThinkPad E and for the 5th generation of X1 Carbon recently announced at CES. In the course of 2017 Lenovo intends to implement the new processLTS on 8 SMT lines and estimated to save up to -35% on carbon emissions. By the end of 2018, using this new process, the company aims to have 33 SMT lines with 2 to line furnaces, with an estimated annual savings of 5,956 tons of CO22. To have a common knowledge of comparison, it is how to save CO2 emissions equivalent to the consumption of approximately 2,536,952 liters of benzina3 year. Through the new process, Lenovo expects improved reliability forits devices due to the reduction of heat stress during the "cooking process in the oven." In the early stages of deployment, Lenovo has already observed a decrease of -50% on the deformation of the printed circuit boards and a reduction of defective parts per million during production. Release Date: Founded in 1984 in HongKONG